Three-dimensional molded interconnect devices (3D-MID)
Franke JörgKniha
Citácie v zozname literatúry:
FRANKE, Jörg. Three-dimensional molded interconnect devices (3D-MID): materials, Manufacturing, assembly, and applications for injection molded circuit carriers. Munich: Hanser, [2014]. ISBN 9781569905524. Dostupné také z: https://proxy.k.utb.cz/login?url=http://app.knovel.com/hotlink/toc/id:kpTDMIDDM6/threedimensional_molded_interconnect_devices_3dmid__materials_manufacturing_assembly_and_applications_for_injection_molded_circuit_carriers.